High Performance Hhl Packaged 105µm / 200µm 808nm Pump Laser Diode Module K808d09fn-4.00w

High Performance Hhl Packaged 105µm / 200µm 808nm Pump Laser Diode Module K808d09fn-4.00w

  • High Performance Hhl Packaged 105µm / 200µm 808nm Pump Laser Diode Module K808d09fn-4.00w
  • High Performance Hhl Packaged 105µm / 200µm 808nm Pump Laser Diode Module K808d09fn-4.00w

Product Description

808nm High performance HHL Packaged 105µm / 200µm Pump Laser Diode Module K808D/K09F-4.00W
 

Features:

  •    output power 4W, 8W
  •    fiber core diameter 105µm, 200µmand 400µm
  •    0.22N.A.
  •    808nm wavelength

Applications:

  •  Laser pumping
  •  Material processing
  •  Medical use 

 

Specifications(25℃)

Symbol

Unit

K808D09FN-4.00W

K808D09FN-8.00W

Optical Data

CW-Output Power

Po

W

4

8

Center Wavelength

λc

nm

808

Tolerance of λ

-

nm

±3, ±10

Spectral Width (FWHM)

λ

nm

<3

Temperature Drift of λ

-

nm/℃

~0.3

Fiber Data(1)

Fiber Core Diameter

Wc

µm

105, 200

200, 400

Numerical Aperture

N.A.

-

0.22

Fiber Connector

-

-

SMA-905

Electrical Data

Operating Current

Iop

A

5.0

10.0

Threshold Current

Ith

A

0.8

1.5

Conversion Efficiency

η

%

35~45

Slope Efficiency

ηD

W/A

0.8~1.0

Operating Voltage

Vop

V

1.9

2.2

Reverse Voltage

Vre

V

2

PD Data

Current

Imo

mA

0.20~1.50

TEC Data

Max. Current

It

A

4.0

6.0

Max. Voltage

Vt

V

9.8

Thermistor Data(2)

Thermistor

Rt

(K Ω)/β(25℃)

10±5%/3477

Others

Operating Temperature

Top

10~30

Storage Temperature

Tst

-20~80

Expected Lifetime

MTTF

h

>10, 000

Dimensions (fiber and connector not included)

-

mm

~44.5×31.8×18.0

Lead Soldering Temperature

Tis

260(10 sec.)

 

(1)    Other fibers available upon request.

(2)    Rt=R0·exp ( β(1/T—1/T0)), (T0=25℃=298K).

 

 

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